Description
A range of water based, 2-part chemical setting adhesive products, which have similar characteristics and properties to the ready-to-use adhesives & cements, but are formulated for thick film applications, or where air drying is not practical or possible, e.g. potting, encapsulation. Supplied as a powder filler and liquid binder.
Summary
PRODUCT |
Temp °C |
Description |
1000°C |
Manufactured from the same materials as Light, Medium & Heavy adhesive cements, QS/B4 can be mixed to these consistencies.
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|
1000°C |
Designed to provide, good dielectric strength, low thermal expansion, high tensile and compressive strength.
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|
CHROMIX |
1400°C |
Good bond strength to metals. High tensile and compressive strength. Provides an efficient gas tight seal and heat resistant filler.
|
1600°C |
High alumina content. Very high temperature resistance and dielectric properties, higher thermal conductivity.
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Coming soon