| Fortafix High Temperature
Adhesive - Medium Grade |
|
A cold setting dense, white, water based
ceramic paste. Medium Grade is ideal for bonding, assembling, selaing,
jointing or repairing glass, ceramics, metals, quartz, steatite
etc. Fortafix Medum Grade possess excellent adhesive, thermal, electrical
and mechanical properties. Maximum continuous working temperature
is >+1000°C. |
|
Typically Used For |
Elements
Heaters
Hot Plates
Resistors
Ovens
Thermocouples.
|
|
Suitable For |
Thin films/Coating - Yes
Bonding - Yes
Encapsulation - No
Thick Sections - No
|
|
Property |
|
Value |
Major Constituent |
|
Alkali Silicate Glass, Inorganic Oxides |
Ready Mixed or 2 part |
|
Ready Mixed |
Dispensable |
|
Yes |
Relative Viscosity |
|
Viscous Paste |
Coverage Rate/Coating Thickness |
|
|
Softening Temperature (°C): |
|
1200°C |
Melting Temperature (°C): |
|
1300°C |
Wet Density (g.cm-3): |
|
2.4 |
Colour: |
|
White |
Compressive Strength: |
|
|
Thermal Conductivity (W.m-1.K-1): |
|
approx. 1-2 |
Thermal Expansion (x10-6C-1): |
|
10 |
Dielectric Strength (KV.mm-1)
@ RT: |
|
7-10 |
Volume Resistivity (Ωcm) @ RT: |
|
>10^7 |
pH: |
|
13 |
Expansion on Setting %: |
|
0 |
Shrinkage (Linear %): 150-500°C |
|
|
Shrinkage (Volume %): 150-500°C |
|
|
Hardness Moh’s Scale |
|
|
Oxidation Resistance |
|
Excellent |
Alkali Resistance |
|
Can be re-dissolved at high pH & temperature |
Acid Resistance |
|
Excellent - except hydrofluoric |
Cure Guide |
|
Water based product - requires heat curing (See below) |
Shelf Life: |
|
12 Months |
Packaging: |
|
250ml, 1litre, 5 litre, 25 litre or other to special order. |
|
|
|
Additional Information |
| None |
|
Application |
IT IS ESSENTIAL THAT ALL SURFACES TO BE BONDED ARE
FREE FROM OIL, DUST OR ANY FORM OF SURFACE COATING OR CONTAMINATION.
Stir contents of the container prior to use, to overcome the effects
of any settlement of the ingredients during storage.
Ensure that all surfaces to be bonded sealed or insulated, are
degreased, clean and free from contamination.
A light surface abrasion of the material to be bonded will increase
the amount of surface area available for adhesion and will give
improved mechanical key.
Apply the adhesive to all surfaces to be bonded.
Join and apply moderate pressure to ensure even anchorage and
solid contact of the surfaces to be bonded, ensure that all surface
are fully wetted by the adhesive.
Secure the components and allow the adhesive to set and harden.
|
|
Curing |
This product is water based. In order to cure of the material it
is necessary to fully dry & dehydrate the adhesive, by heating
as gently & progressively as time and circumstances will allow.
The ease by which full curing can be achieved is dependant on the
porosity of the substrate, as well as the amount of available surface
through which the adhesive film can dry.
The cement should be allowed to harden at a minimum air temperature
of 20°C until initial set has taken place. After this period the
hardening process may be accelerated using the following typical
schedule;
Heat from 20° to 80°C @ 4°C per minute (15 minutes). Hold for
10-20 minutes
Heat from 80° to 140°C @ 2°C per minute (30 minutes). Hold for
120-180 minutes
Heat from 140° to 200°C @ 0.2°C per minute (300 minutes).
Above 200°C - raise temperature @ 1°C per minute to required temperature,
allow to cool progressively.
Hardening and curing times given are approximate in view of possible
variations in adhesive volume, glue line thickness, and substrate
conditions, all of which will influence curing times.
|
|
Associated Documents |
| MSDS
- Fortafix Medium Grade
|