Description
HT BondFlow 300 is a pourable elastomeric Silicone Sealants for use where good adhesion and a flexible joint is required, with high temperature resistance. It is are Ideal for sealing and bonding of materials to withstand temperatures of 300°C. Gives excellent adhesion between most substrates and can be used for jointing materials of different thermal expansion & where vibration is a problem. Suitable for pouring.
Summary
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Bondflow 300 Data Sheet |
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MSDS Bondflow 300 |
Coming soon